公开(公告)号：US20170005063A1

公开(公告)日：2017-01-05

申请号：US15080566

申请日：2016-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-gyu KANG ,  Kun-ho SONG ,  Jung-hun SUNG ,  Ju-young YU

IPC: H01L23/00 ,  B23K3/08 ,  B23K1/00

CPC classification number: H01L24/742 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/087 ,  H01L2224/75102 ,  H01L2224/75272 ,  H01L2224/75651 ,  H01L2924/3512

Abstract: A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.

Abstract translation: 回流装置包括通过使用其中产生的真空压力而支撑放置在其一侧的印刷电路板的载体，以及包括加热室和冷却室的处理室，其中载体包括形成在一个中的至少一个吸附孔 载体的一侧，连接到吸附孔的真空空间，以及真空控制单元，其能够通过选择性地打开和闭合将真空空间连接到外部的路径来维持或去除真空空间中的真空压力。