Invention Application
- Patent Title: STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE
- Patent Title (中): 芯片包装的结构和形成方法
-
Application No.: US15003150Application Date: 2016-01-21
-
Publication No.: US20170005072A1Publication Date: 2017-01-05
- Inventor: Wen-Hsin WEI , Chi-Hsi WU , Chen-Hua YU , Hsien-Pin HU , Shang-Yun HOU , Wei-Ming CHEN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L21/3105 ; H01L21/56 ; H01L25/00 ; H01L23/31 ; H01L23/538
Abstract:
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
Public/Granted literature
- US09806058B2 Chip package having die structures of different heights and method of forming same Public/Granted day:2017-10-31
Information query
IPC分类:
