Invention Application
- Patent Title: CONNECTOR COMPONENT
- Patent Title (中): 连接器组件
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Application No.: US15039762Application Date: 2013-12-02
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Publication No.: US20170005422A1Publication Date: 2017-01-05
- Inventor: Chi So , Robert C. Brooks , Bruce Trevino
- Applicant: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.
- International Application: PCT/US2013/072683 WO 20131202
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/73

Abstract:
In one example in accordance with the present disclosure, a connector component is provided. The connector component includes a first connector portion comprising a plurality of contacts to couple with a printed circuit board, and a second connector portion comprising a plurality of contacts to couple with an M.2 form factor module. The second connector portion is to receive the M.2 form factor module in an upright orientation such that neither a front surface nor a rear surface of the M.2 form factor module substantially faces the printed circuit board. In addition, the second connector portion is to retain the M.2 form factor module in the upright orientation without a retention mechanism external to the connector component.
Public/Granted literature
- US10193249B2 Connector component and retention mechanism for M.2 form factor module Public/Granted day:2019-01-29
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