公开(公告)号：US20170005422A1

公开(公告)日：2017-01-05

申请号：US15039762

申请日：2013-12-02

Applicant: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chi So ,  Robert C. Brooks ,  Bruce Trevino

IPC: H01R12/70 ,  H01R12/73

CPC classification number: H01R12/7076 ,  H01R12/7005 ,  H01R12/718 ,  H01R12/737

Abstract: In one example in accordance with the present disclosure, a connector component is provided. The connector component includes a first connector portion comprising a plurality of contacts to couple with a printed circuit board, and a second connector portion comprising a plurality of contacts to couple with an M.2 form factor module. The second connector portion is to receive the M.2 form factor module in an upright orientation such that neither a front surface nor a rear surface of the M.2 form factor module substantially faces the printed circuit board. In addition, the second connector portion is to retain the M.2 form factor module in the upright orientation without a retention mechanism external to the connector component.

Abstract translation: 在根据本公开的一个示例中，提供了连接器部件。 连接器部件包括第一连接器部分，第一连接器部分包括多个触点以与印刷电路板耦合，第二连接器部分包括多个触点以与M.2形状因子模块耦合。 第二连接器部分以直立方向接收M.2形状因子模块，使得M.2形状因子模块的前表面和后表面都不大致面向印刷电路板。 此外，第二连接器部分是将M.2形状因子模块保持在直立方向，而不需要在连接器部件外部的保持机构。

公开(公告)号：US10193249B2

公开(公告)日：2019-01-29

申请号：US15039762

申请日：2013-12-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi So ,  Robert C Brooks ,  Bruce Trevino

IPC: H05K5/00 ,  H01R12/70 ,  H01R12/73 ,  H01R12/71

Abstract: In one example in accordance with the present disclosure, a connector component is provided. The connector component includes a first connector portion comprising a plurality of contacts to couple with a printed circuit board, and a second connector portion comprising a plurality of contacts to couple with an M.2 form factor module. The second connector portion is to receive the M.2 form factor module in an upright orientation such that neither a front surface nor a rear surface of the M.2 form factor module substantially faces the printed circuit board. In addition, the second connector portion is to retain the M.2 form factor module in the upright orientation without a retention mechanism external to the connector component.

公开(公告)号：US10146623B2

公开(公告)日：2018-12-04

申请号：US15035483

申请日：2013-11-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Byron A. Alcorn ,  Bruce Trevino ,  Scotty M. Wiginton

IPC: G06F11/00 ,  G06F11/10 ,  G06F11/32 ,  G06F9/4401 ,  G06F11/22 ,  G06F11/07 ,  G06F11/14

Abstract: Example implementations relate to obtaining information about and indicating a state of a storage device. In example implementations, an indication that a storage device is rebuilding address mappings may be received, and how much progress has been made in the rebuilding may be determined. A representation of the progress made in the rebuilding may be displayed.