Invention Application
- Patent Title: MEMORY MODULE CONNECTOR
- Patent Title (中): 内存模块连接器
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Application No.: US15106655Application Date: 2014-01-29
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Publication No.: US20170005438A1Publication Date: 2017-01-05
- Inventor: Melvin K Benedict , Stephen F Contreras
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- International Application: PCT/US2014/013491 WO 20140129
- Main IPC: H01R13/6471
- IPC: H01R13/6471 ; H01R12/73

Abstract:
A memory module connector (100) is described herein. The memory module connector (100) comprises a plurality of connector pins (102) distributed into a plurality of columns (104). The plurality of connector pins (102) further comprises a plurality of ground pins (106) for providing electrical ground to the memory module connector (100) and a plurality of signal pins (108) for carrying data signals across the memory module connector (100). Further, for each signal pin (108) provided in a column (104), each connector pin (102) adjacent to the signal pin (108) in an adjacent column (104) is a ground pin (106).
Public/Granted literature
- US09972941B2 Memory module connector Public/Granted day:2018-05-15
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