Invention Application
- Patent Title: LOAD LOCK APPARATUS AND SUBSTRATE PROCESSING SYSTEM
- Patent Title (中): 负载锁定装置和基板处理系统
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Application No.: US15216161Application Date: 2016-07-21
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Publication No.: US20170025290A1Publication Date: 2017-01-26
- Inventor: Shinji WAKABAYASHI
- Applicant: TOKYO ELECTRON LIMITED
- Priority: JP2015-146912 20150724
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A load lock apparatus having a load lock chamber, which is connected to a vacuum transfer chamber configured to transfer a substrate under a vacuum pressure state via a communication hole which is opened and closed by a gate valve, and configured to be capable of switching an inner pressure into an atmospheric pressure state and the vacuum pressure state, is provided. The load lock apparatus includes a load lock chamber main body in which a substrate container having an attachable/detachable cover is carried, wherein the communication hole is formed in a side surface of the load lock chamber; and a cover attaching/detaching mechanism installed at a height position vertically arranged with the communication hole in the load lock chamber; and an elevating mechanism including a mounting table on which the substrate container is loaded and configured to lift and lower the mounting table.
Public/Granted literature
- US10431481B2 Load lock apparatus and substrate processing system Public/Granted day:2019-10-01
Information query
IPC分类:
