Invention Application
US20170025372A1 SEMICONDUCTOR MODULE, BONDING JIG, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
有权
半导体模块，接合模块和半导体模块的制造方法
- Patent Title: SEMICONDUCTOR MODULE, BONDING JIG, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
- Patent Title (中): 半导体模块，接合模块和半导体模块的制造方法
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Application No.: US15284714Application Date: 2016-10-04
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Publication No.: US20170025372A1Publication Date: 2017-01-26
- Inventor: Kazuaki KOJIMA
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2014-084809 20140416
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L27/146 ; H01L23/498
Abstract:
A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.
Public/Granted literature
- US09881890B2 Semiconductor module, bonding jig, and manufacturing method of semiconductor module Public/Granted day:2018-01-30
Information query
IPC分类:
