公开(公告)号：US20180235089A1

公开(公告)日：2018-08-16

申请号：US15804207

申请日：2017-11-06

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: H05K3/20 ,  H05K1/11 ,  H01L21/768 ,  H05K1/18 ,  H05K3/10 ,  H01L21/48 ,  H05K3/40

CPC classification number: H05K3/205 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K3/02 ,  H05K3/10 ,  H05K3/4038 ,  H05K3/4061 ,  H05K3/421 ,  H05K2201/09036 ,  H05K2203/0726

Abstract: For a wiring board, silicon including a first main surface and a second main surface is a base, a first conductor on the first main surface and a second conductor on the second main surface are connected by a through electrode formed of an electroplating layer disposed on an inner surface of a through hole, a bottom surface of which is the second conductor, and a hilling which is a continuous projecting portion is provided on the inner surface of the through hole from the first main surface to the second main surface in parallel with a depth direction.

公开(公告)号：US20150312457A1

公开(公告)日：2015-10-29

申请号：US14793111

申请日：2015-07-07

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: H04N5/225 ,  H05K1/18 ,  A61B1/05 ,  H05K5/04 ,  H04N5/369 ,  H05K3/34 ,  H05K1/02

CPC classification number: H04N5/2257 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/051 ,  G02B23/2484 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/021 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3431 ,  H05K5/04 ,  H05K2201/055 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1305 ,  H05K2203/302

Abstract: A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

Abstract translation: 图像拾取装置的制造方法包括制造图像拾取器件芯片的步骤，制造具有第一端子的布线板和布置在第一主表面的两侧上的第二端子的步骤，中间柔性部分介于其间， 将导热块接合到布线基板的第二主面的步骤，将图像拾取器件芯片连接到布线板的第一端子的步骤，将电缆的芯线焊接到 通过导热块导热由热工具产生的热量的布线板的第二端子，弯曲布线板的步骤，以及在框架构件内进行壳体的步骤，并用密封树脂密封。

公开(公告)号：US20170025372A1

公开(公告)日：2017-01-26

申请号：US15284714

申请日：2016-10-04

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: H01L23/00 ,  H01L21/48 ,  H01L27/146 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/75 ,  H01L24/81 ,  H01L27/14636 ,  H01L2224/13111 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/50 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/014 ,  H01L2924/12043 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/068

Abstract: A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.

Abstract translation: 半导体模块包括其上设置有凸块的图像拾取装置和具有柔性树脂作为基底的柔性布线板，并且包括具有焊接到凸块的末端部分处的焊接接合的接合电极的导线，其中， 接合电极通过加热引起的焊接接合温度引起的布线板的弯曲/变形而压在凸块上。

公开(公告)号：US20210389581A1

公开(公告)日：2021-12-16

申请号：US17412565

申请日：2021-08-26

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: G02B23/24 ,  G02B23/26 ,  H04N5/225 ,  H04N7/22

Abstract: An image pickup apparatus for endoscope includes an image pickup device, an optical element, an optical fiber, a fiber tube, a plurality of metal cables, a cable tube, and a wire rod wound around the cable tube and the fiber tube to integrate the cable tube and the fiber tube. The plurality of metal cables are fixed to the cable tube deformed by the wire rod. The optical fiber is not fixed to the fiber tube by the wire rod.

公开(公告)号：US20170238785A1

公开(公告)日：2017-08-24

申请号：US15591778

申请日：2017-05-10

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Kazuaki KOJIMA

IPC: A61B1/00 ,  A61B1/05 ,  H01L27/146 ,  G02B13/00 ,  G02B23/24

CPC classification number: A61B1/0011 ,  A61B1/00096 ,  A61B1/00163 ,  A61B1/051 ,  B32B37/14 ,  B32B38/10 ,  G02B7/02 ,  G02B13/0035 ,  G02B13/006 ,  G02B13/0065 ,  G02B13/007 ,  G02B13/0085 ,  G02B23/243 ,  H01L27/14643 ,  H01L27/14687 ,  H04N5/2254 ,  H04N5/335 ,  Y10T156/1052

Abstract: A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.

公开(公告)号：US20180338674A1

公开(公告)日：2018-11-29

申请号：US16055213

申请日：2018-08-06

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: A61B1/05 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup apparatus includes: a wiring board that has a first main surface and a second main surface; an electronic components that include an image pickup device mounted on the wiring board; and conductive wires bonded to the wiring board. The wiring board includes a first area disposed in an XY plane, a second area extended from a distal end portion of the first area and disposed in an XZ plane, a third area extended from a first side surface of the first area and disposed in a YZ plane, and a fourth area extended from a distal end portion of the third area and disposed in the XZ plane. The first main surface of the second area is a distal end surface, and the image pickup device is mounted on the distal end surface.

公开(公告)号：US20180000327A1

公开(公告)日：2018-01-04

申请号：US15706681

申请日：2017-09-16

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: A61B1/04 ,  H01L27/14 ,  H04N5/225 ,  H04N7/18

CPC classification number: A61B1/04 ,  H01L27/14 ,  H04N5/225 ,  H04N5/2253 ,  H04N7/18 ,  H04N2005/2255

Abstract: An image pickup apparatus includes: an image pickup device that includes a light receiving surface, an opposite surface, a light receiving portion, and external electrodes connected to the light receiving portion; and a wiring board that includes a first main surface, a second man surface, and a wiring portion provided with first bonding electrodes bonded to the external electrodes, wherein the first main surface of the wiring portion is arranged at a first angle θ1 equal to or smaller than 90 degrees relative to the opposite surface, the wiring board includes a reinforced portion and a folded portion bent at the first angle θ1 between the reinforced portion and the wiring portion, and the second main surface of the reinforced portion is fixed to the opposite surface of the image pickup device.

公开(公告)号：US20140346322A1

公开(公告)日：2014-11-27

申请号：US14456560

申请日：2014-08-11

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Kazuaki KOJIMA

IPC: H04N5/335 ,  B32B37/14 ,  B32B38/10

CPC classification number: A61B1/0011 ,  A61B1/00096 ,  A61B1/00163 ,  A61B1/051 ,  B32B37/14 ,  B32B38/10 ,  G02B7/02 ,  G02B13/0035 ,  G02B13/006 ,  G02B13/0065 ,  G02B13/007 ,  G02B13/0085 ,  G02B23/243 ,  H01L27/14643 ,  H01L27/14687 ,  H04N5/2254 ,  H04N5/335 ,  Y10T156/1052

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract translation: 一种光学单元的制造方法，其特征在于，具有：形成有多个透镜单元的透镜单元晶片的多个透镜晶片的形成工序; 将包括多个弯曲光学元件的弯曲光学元件晶片接合到透镜单元晶片的第一表面的步骤，使得多个弯曲光学元件分别与多个透镜单元相对并形成光学单元晶片; 以及对于每个透镜单元和弯曲光学元件分离和个体化光学单元晶片并制造多个光学单元的步骤。

公开(公告)号：US20130184525A1

公开(公告)日：2013-07-18

申请号：US13787212

申请日：2013-03-06

Applicant: Olympus Corporation

Inventor： Kazuaki KOJIMA

IPC: A61B1/05

CPC classification number: A61B1/05 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/051 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A distal end rigid member, a prism provided inside the distal end rigid member and positioned at the rear in an optical axis direction of a lens for observing a site to be examined, an image pickup device fixed to a light exit surface of the prism inside the distal end rigid member, and a substrate including a surface fixed to the image pickup device and another surface fixed to an inner circumferential face of the distal end rigid member are included, and the other surface of the substrate is formed in a shape that reduces or eliminates a space between the inner circumferential face of the distal end rigid member and the other surface of the substrate.

Abstract translation: 远端刚性构件，设置在远端刚性构件的内侧并位于透镜的光轴方向的后方，用于观察被检查部位的棱镜;固定在棱镜内侧的光出射面的摄像装置 包括远端刚性构件和包括固定到图像拾取装置的表面和固定到远端刚性构件的内周面的另一表面的基板，并且基板的另一个表面形成为减小的形状 或者消除前端刚性构件的内周面与基板的另一面之间的空间。