Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US15286194Application Date: 2016-10-05
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Publication No.: US20170025546A1Publication Date: 2017-01-26
- Inventor: Chiho KOKUBO , Aiko SHIGA , Shunpei YAMAZAKI , Hidekazu MIYAIRI , Koji DAIRIKI , Koichiro TANAKA
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Priority: JP2001-390708 20011221
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12 ; H01L29/04

Abstract:
A first shape of semiconductor region having on its one side a plurality of sharp convex top-end portions is formed first and a continuous wave laser beam is used for radiation from the above region so as to crystallize the first shape of semiconductor region. A continuous wave laser beam condensed in one or plural lines is used for the laser beam. The first shape of semiconductor region is etched to form a second shape of semiconductor region in which a channel forming region and a source and drain region are formed. The second shape of semiconductor region is disposed so that a channel forming range would be formed on respective crystal regions extending from the plurality of convex end portions. A semiconductor region adjacent to the channel forming region is eliminated.
Information query
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