A multi-purpose heat foil embossing machine and a heat foil adapter are disclosed herein. According to an embodiment, the heat foil adapter includes an injection molded body, a metal heat plate configured in the cavity of the molded body, a heating element, a temperature control system configured to maintain metal heat plate temperature, and a polycarbonate lid. According to another embodiment, the multi-purpose heat foil embossing machine is of platform and roller type construction wherein platform provides a flatbed working area and roller is moved over it that eliminates need to sandwich folder between plastic mats and push the mat between the rollers. According to another embodiment, the heat plate adapter is configured within a cavity on the platform of the embossing machine with electric connectivity.