Invention Application
US20170029400A1 Leveler, Leveler Composition and Method for Electrodeposition of Metals in Microelectronics
审中-公开
矫直机，矫直机组成及微电子电沉积金属的方法
- Patent Title: Leveler, Leveler Composition and Method for Electrodeposition of Metals in Microelectronics
- Patent Title (中): 矫直机，矫直机组成及微电子电沉积金属的方法
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Application No.: US15181469Application Date: 2016-06-14
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Publication No.: US20170029400A1Publication Date: 2017-02-02
- Inventor: Yun Zhang , Tao Ma , Peipei Dong , Zifang Zhu , Chen Chen
- Applicant: Yun Zhang , Tao Ma , Peipei Dong , Zifang Zhu , Chen Chen
- Applicant Address: CN Wujiang
- Assignee: Shinhao Materials LLC
- Current Assignee: Shinhao Materials LLC
- Current Assignee Address: CN Wujiang
- Main IPC: C07D311/86
- IPC: C07D311/86 ; C25D3/38 ; C07D311/84
Abstract:
The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof:
Public/Granted literature
- US10323015B2 Leveler, leveler composition and method for electrodeposition of metals in microelectronics Public/Granted day:2019-06-18
Information query
