Invention Application
- Patent Title: HEAT EXCHANGER
- Patent Title (中): 热交换器
-
Application No.: US15223253Application Date: 2016-07-29
-
Publication No.: US20170030650A1Publication Date: 2017-02-02
- Inventor: Sanghoon YOO , Taegyun PARK , Juhyok KIM
- Applicant: LG ELECTRONICS INC.
- Priority: KR10-2015-0108931 20150731
- Main IPC: F28D1/04
- IPC: F28D1/04 ; F28F9/02 ; F28D1/053

Abstract:
A microchannel type heat exchanger is provided. The heat exchanger may include a first heat exchanger and a second heat exchanger, in which a plurality of flat tube may be provided. The heat exchanger may include a first path defined in a first portion of the plurality of flat tubes provided in the first heat exchanger, the first path being configured such that a refrigerant flows in a first direction, a second path defined in a second portion of the plurality of flat tubes provided in the first heat exchanger, the first path being configured such that the refrigerant, supplied from the first path, flows in a second direction opposite to the first direction, a third path defined in a remaining portion of the plurality of flat tubes provided in the first heat exchanger and a portion of the plurality of flat tubes provided in the second heat exchanger, the third path being configured such that the refrigerant, supplied from the second path, flows in a third direction opposite to the second direction, and a fourth path defined in a remaining portion of the plurality of flat tubes provided in the second heat exchanger, the fourth path being configured such that the refrigerant, supplied from the third path, flows in a fourth direction opposite to the third direction.
Public/Granted literature
- US10544990B2 Heat exchanger Public/Granted day:2020-01-28
Information query