Invention Application
- Patent Title: INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
- Patent Title (中): 集成电路及其制造方法
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Application No.: US14813254Application Date: 2015-07-30
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Publication No.: US20170033178A1Publication Date: 2017-02-02
- Inventor: Bharat Krishnan , Shishir Ray , Jinping Liu
- Applicant: GLOBALFOUNDRIES, Inc.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/762
Abstract:
Integrated circuits and methods for producing the same are provided. In accordance with one embodiment a method of producing an integrated circuit includes forming a trench defined by a first material. The trench is filled with a second material to produce a gap defined within the second material, where the second material is in a solid state. The second material is reflowed within the trench to reduce a volume of the gap, and the second material is then solidified within the trench.
Public/Granted literature
- US09640423B2 Integrated circuits and methods for their fabrication Public/Granted day:2017-05-02
Information query
IPC分类:
