SEMICONDUCTOR DEVICE

Invention Application

US20170033206A1 SEMICONDUCTOR DEVICE 有权

Title translation: 半导体器件

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Patent Title: SEMICONDUCTOR DEVICE
Patent Title (中): 半导体器件
Application No.: US15171634

Application Date: 2016-06-02
Publication No.: US20170033206A1

Publication Date: 2017-02-02
Inventor: Hitoshi MATSUURA
Applicant: RENESAS ELECTRONICS CORPORATION
Priority: JP2015-151267 20150730
Main IPC: H01L29/739
IPC: H01L29/739 ; H01L29/40 ; H01L29/10 ; H01L29/06

Abstract:

The performance of a semiconductor device is improved. An emitter electrode is coupled to a P-type body region and an N+-type emitter region of a linear active cell region via a contact groove formed on an interlayer insulating film and is coupled to a P-type body region of a linear hole connector cell region via a contact groove. The contact grooves arranged in the linear hole connector cell region are shorter than the contact groove in plan view.

Abstract(Chinese):

提高了半导体器件的性能。发射电极经由形成在层间绝缘膜上的接触槽与P型体区域和线性有源电极区域的N +型发射极区域耦合，并连接到线性孔连接器的P型体区域电池区域。布置在直孔连接孔单元区域中的接触槽在平面图中比接触槽短。

Public/Granted literature

US09786771B2 Semiconductor device with contact groove arrangements providing improved performance Public/Granted day:2017-10-10

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/70	...双极器件
H01L29/72	....晶体管型器件，如连续响应于所施加的控制信号的
H01L29/739	.....受场效应控制的