Invention Application
- Patent Title: ACOUSTIC WAVE DEVICE AND MODULE
- Patent Title (中): 声波设备和模块
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Application No.: US15217105Application Date: 2016-07-22
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Publication No.: US20170033765A1Publication Date: 2017-02-02
- Inventor: Akira MORIYA , Osamu KAWACHI
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2015-150158 20150729
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/145 ; H03H9/64
Abstract:
An acoustic wave device includes: a support substrate; a piezoelectric substrate bonded on an upper surface of the support substrate at room temperature and made of a different material from the support substrate; a comb-shaped electrode formed on an upper surface of the piezoelectric substrate and exciting an acoustic wave; and an amorphous layer formed between the support substrate and the piezoelectric substrate.
Information query
