Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US15223241Application Date: 2016-07-29
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Publication No.: US20170034909A1Publication Date: 2017-02-02
- Inventor: Daisuke YAMAUCHI , Hiroyuki TANABE
- Applicant: Nitto Denko Corporation
- Priority: JP2015-152613 20150731; JP2016-139880 20160715
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G11B5/48 ; H05K1/09 ; H05K3/46 ; H05K1/03

Abstract:
A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
Public/Granted literature
- US09940957B2 Printed circuit board and method of manufacturing the same Public/Granted day:2018-04-10
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