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公开(公告)号：US20170171970A1
公开(公告)日：2017-06-15
申请号：US15373583
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Naohiro TERADA , Yuu SUGIMOTO , Daisuke YAMAUCHI
CPC classification number: H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side in the thickness direction of the base insulating layer and a second cover insulating layer disposed at one side in the thickness direction of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.
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2.发明申请SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME 审中-公开具有电路的悬挂板组装片及其制造方法及其检测方法公开(公告)号：US20170019985A1
公开(公告)日：2017-01-19
申请号：US15208655
申请日：2016-07-13
Applicant: Nitto Denko Corporation
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Naohiro TERADA
CPC classification number: H05K1/0268 , G01R1/04 , G11B5/486 , H05K1/115 , H05K1/142 , H05K3/0097 , H05K3/424 , H05K2203/0165 , H05K2203/162
Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
Abstract translation: 悬架板和检查基板由支撑框架一体地支撑。 在悬挂板中，依次将第一绝缘层和第二绝缘层层叠在支撑基板上。 一部分线形成在第一绝缘层上，剩余的线形成在第二绝缘层上。 在第二绝缘层中形成将线的一部分连接到剩余线的A通孔。 在检查基板中，第一绝缘层和第二绝缘层依次层叠在支撑基板上。 在第一绝缘层上形成第一检查导体层，在第二绝缘层上形成第二检查导体层。 在第二绝缘层中形成连接第一检查导体层和第二检查导体层的通孔。
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公开(公告)号：US20160262265A1
公开(公告)日：2016-09-08
申请号：US15057518
申请日：2016-03-01
Applicant: Nitto Denko Corporation
Inventor： Hiroyuki TANABE , Daisuke YAMAUCHI
CPC classification number: H05K1/11 , G11B5/484 , H05K1/0242 , H05K1/09 , H05K1/111 , H05K3/0061 , H05K3/181 , H05K3/285 , H05K3/384 , H05K3/40 , H05K2201/0154 , H05K2201/09081 , H05K2201/10931 , H05K2203/072
Abstract: A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.
Abstract translation: 印刷电路板包括第一和第二绝缘层，布线迹线，金属薄膜和连接端子。 布线迹线形成在第一绝缘层上。 金属薄膜形成在布线轨迹上，其厚度大于0nm且不大于150nm。 第二绝缘层形成在第一绝缘层上以覆盖金属薄膜。 连接端子形成在第一绝缘层上以与布线迹线电连接并从第二绝缘层暴露。
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公开(公告)号：US20160105954A1
公开(公告)日：2016-04-14
申请号：US14877424
申请日：2015-10-07
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
CPC classification number: H05K1/0271 , G11B5/484 , G11B5/4853 , H05K1/056 , H05K3/4685 , H05K2201/09245 , H05K2203/0323
Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.
Abstract translation: 具有电路的悬挂板包括金属支撑板，第一绝缘层，包括形成在金属支撑板的厚度方向上的一侧的布置部分;第一导电层，包括形成在第一导电层的一侧的第一导线部分 绝缘层，包括覆盖第一导线部分的覆盖部分的第二绝缘层，以及包括形成在第二绝缘层一侧的第二导线部分和连接到第一或第二导线部分的端子部分的第二导电层。 第二绝缘层包括形成在端子部分另一端的第二端子支撑部分。 第一绝缘层包括形成在第二端子支撑部分的另一侧的第一端子支撑部分。 金属支撑板不形成在其另一侧。
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公开(公告)号：US20150156892A1
公开(公告)日：2015-06-04
申请号：US14558070
申请日：2014-12-02
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Hitoki KANAGAWA
IPC: H05K3/46
CPC classification number: H05K3/4661 , C25D5/02 , G11B5/4873 , H05K1/056 , H05K3/44
Abstract: A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.
Abstract translation: 具有电路的悬挂板的制造方法包括以下步骤：（7）通过蚀刻去除与第二端子对应的第一端子和/或第二无电镀层的第一化学镀层，（8）除去金属支撑 与第一导电层的下表面接触，填充第一开口部分的内部，以及（9）在第一端子的表面上提供电解镀层，其中第一化学镀层被去除和/或 除去第二无电镀层的第二端子，并且通过电解电镀从第一开口部分的内部暴露于第一导电层的下表面，从金属支撑板供电。
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Patent Agency Ranking
公开(公告)号：US20180358037A1
公开(公告)日：2018-12-13
申请号：US15996897
申请日：2018-06-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito FUJIMURA , Hiroyuki TANABE , Yuu SUGIMOTO
CPC classification number: G11B5/484 , H05K1/115 , H05K1/181 , H05K3/0023 , H05K3/188 , H05K3/341 , H05K3/3494 , H05K3/4007 , H05K3/4038 , H05K3/4644 , H05K2201/09027 , H05K2201/10083 , H05K2201/10121 , H05K2201/10159 , H05K2203/0723
Abstract: The suspension board with circuits can mount a slider and an electronic component, and includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a first conductive layer including an electronic component-connection terminal for electrically connecting with the electronic component, and a first wire disposed on the first insulating layer; a second conductive layer including a magnetic head-connection terminal for electrically connecting with a magnetic head provided in the slider, and a second wire, wherein at least a portion of the second wire is disposed on the second insulating layer. The suspension board with circuits has a pedestal supporting the slider. The pedestal includes the first insulating layer, second insulating layer, third insulating layer, and one of the first wire and second wire.
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公开(公告)号：US20170303390A1
公开(公告)日：2017-10-19
申请号：US15488808
申请日：2017-04-17
Applicant: Nitto Denko Corporation
Inventor： Daisuke YAMAUCHI , Hiroyuki TANABE
Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.
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公开(公告)号：US20170295650A1
公开(公告)日：2017-10-12
申请号：US15478711
申请日：2017-04-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US20170034909A1
公开(公告)日：2017-02-02
申请号：US15223241
申请日：2016-07-29
Applicant: Nitto Denko Corporation
Inventor： Daisuke YAMAUCHI , Hiroyuki TANABE
CPC classification number: G11B5/4833 , G11B5/484 , H05K1/056 , H05K1/09 , H05K1/111 , H05K3/244 , H05K3/388 , H05K2201/0341 , H05K2201/0347 , H05K2201/05 , Y02P70/611
Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
Abstract translation: 在基底绝缘层上形成导体迹线。 导体迹线包括两个端子部分和一个布线部分。 布线部形成为将两个端子部彼此连接并从各端子部延伸。 形成金属覆盖层以覆盖导体迹线的端子部分和布线部分并且从端子部分的表面连续地延伸到布线部分的表面。 金属覆盖层由具有低于镍的磁性的金属制成，例如由金制成。 在绝缘层上形成覆盖绝缘层，以覆盖形成在导体迹线上的金属覆盖层的覆盖布线部分的部分，而不覆盖覆盖端子部分的金属覆盖层的一部分。
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公开(公告)号：US20150179196A1
公开(公告)日：2015-06-25
申请号：US14580850
申请日：2014-12-23
Applicant: NITTO DENKO CORPORATION
Inventor： Tomoaki OKUNO , Hiroyuki TANABE , Yoshito FUJIMURA , Naohiro TERADA
IPC: G11B5/48
CPC classification number: G11B5/4826 , G11B5/4853 , G11B5/4873 , G11B21/24
Abstract: A head gimbal assembly includes a suspension board with circuit, a pair of piezoelectric elements mounted on the suspension board with circuit to be expandable/contractible, and a slider on which a magnetic head is mounted and which is mounted on the suspension board with circuit and configured to be able to swing with expansion/contraction of the pair of piezoelectric elements. The pair of piezoelectric elements are placed on the suspension board with circuit such that a first imaginary line extending along an expanding/contracting direction of one of the piezoelectric elements crosses a second imaginary line extending along an expanding/contracting direction of the other piezoelectric element.
Abstract translation: 头万向架组件包括具有电路的悬挂板，安装在具有可扩张/收缩的电路的悬挂板上的一对压电元件和安装有磁头的滑块，并且其上安装有具有电路的悬挂板 被构造成能够随着所述一对压电元件的膨胀/收缩而摆动。 一对压电元件被放置在具有电路的悬挂板上，使得沿着一个压电元件的扩张/收缩方向延伸的第一假想线与沿另一个压电元件的扩展/收缩方向延伸的第二假想线交叉。
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