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发明申请
US20170034926A1 Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device 审中-公开
载体铜箔，层压板，制造印刷线路板的方法和制造电子装置的方法

  • 专利标题： Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
  • 专利标题（中）： 载体铜箔，层压板，制造印刷线路板的方法和制造电子装置的方法
  • 申请号： US15218449
    申请日： 2016-07-25
  • 公开(公告)号： US20170034926A1
    公开(公告)日： 2017-02-02
  • 发明人: Terumasa Moriyama , Tomota Nagaura
  • 申请人： JX Nippon Mining & Metals Corporation
  • 优先权： JP2015-148173 20150727; JP2016-027055 20160216
  • 主分类号： H05K3/46
  • IPC分类号： H05K3/46 ;  H05K3/06 ;  H05K3/02 ;  H05K3/00 ;  H05K3/18
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
摘要：
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
摘要（中）：

提供具有良好电路成形性的载体附着铜箔。 载体附着铜箔依次具有载体，中间层和超薄铜层，超薄铜层的贯通厚度方向的单位截面积的晶粒数为0.1个 至5粒/μm2，超薄铜层侧表面的十点平均粗糙度Rz为0.1〜2.0μm。

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