Invention Application
- Patent Title: STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF
- Patent Title (中): 用于电气连接的堆叠框架及其制造方法
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Application No.: US15334307Application Date: 2016-10-26
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Publication No.: US20170047229A1Publication Date: 2017-02-16
- Inventor: BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
- Applicant: CYNTEC CO., LTD.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/495
Abstract:
A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
Public/Granted literature
- US09741590B2 Stack frame for electrical connections and the method to fabricate thereof Public/Granted day:2017-08-22
Information query
IPC分类:
