公开(公告)号：US20180233380A1

公开(公告)日：2018-08-16

申请号：US15955696

申请日：2018-04-18

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L21/768 ,  H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.

公开(公告)号：US20170316954A1

公开(公告)日：2017-11-02

申请号：US15654703

申请日：2017-07-20

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L21/768 ,  H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US20170047229A1

公开(公告)日：2017-02-16

申请号：US15334307

申请日：2016-10-26

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Abstract translation: 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。

公开(公告)号：US20200176270A1

公开(公告)日：2020-06-04

申请号：US16782039

申请日：2020-02-04

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US20150102475A1

公开(公告)日：2015-04-16

申请号：US14576199

申请日：2014-12-19

Applicant: CYNTEC CO., LTD.

Inventor： Han-Hsiang Lee ,  YI-CHENG LIN ,  DA-JUNG CHEN

IPC: H01L23/495 ,  H01L25/07 ,  H01L25/16 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.

Abstract translation: 本发明公开了一种用于更好散热或EMI性能的封装结构。 第一导电元件和第二导电元件都设置在顶部引线框架和底部引线框架之间。 第一导电元件的第一端子电连接到底部引线框架，并且第一导电元件的第二端子电连接到顶部引线框架。 第二导电元件的第三端子电连接到底部引线框架，并且第二导电元件的第四端子电连接到顶部引线框架。 在一个实施例中，散热装置设置在顶部引线框架上。 在一个实施方案中，模塑料被设置成使得顶部引线框架的外部引线暴露在模塑料外部。