Invention Application
- Patent Title: CONNECTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 连接器结构及其制造方法
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Application No.: US14826257Application Date: 2015-08-14
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Publication No.: US20170047245A1Publication Date: 2017-02-16
- Inventor: Shih-Hung Chen
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L23/532 ; H01L23/522
Abstract:
A connector structure for electrically contacting with a conductive layer disposed on a substrate is provided. The connector structure comprises a conductive connecting element disposed on the substrate. The conductive connecting element comprises a connecting part and an extending part. The connecting part has a bottom portion electrically contacting with the conductive layer. The extending part laterally extends outwards from a top portion of the connecting part, and the extending part and the connecting part are respectively formed of different materials.
Public/Granted literature
- US09922877B2 Connector structure and method for fabricating the same Public/Granted day:2018-03-20
Information query
IPC分类:
