Invention Application
US20170055343A1 WIRING BOARD, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF WIRING BOARD
审中-公开
接线板，电子设备和接线板的制造方法
- Patent Title: WIRING BOARD, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF WIRING BOARD
- Patent Title (中): 接线板，电子设备和接线板的制造方法
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Application No.: US15233216Application Date: 2016-08-10
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Publication No.: US20170055343A1Publication Date: 2017-02-23
- Inventor: Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Yoshiyuki Hiroshima , Kohei Choraku
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2015-163103 20150820
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/02 ; H05K9/00 ; H05K3/00 ; H05K1/18
Abstract:
A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.
Public/Granted literature
- US10164312B2 Wiring board, electronic apparatus, and manufacturing method of wiring board Public/Granted day:2018-12-25
Information query
