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公开(公告)号：US20180184514A1
公开(公告)日：2018-06-28
申请号：US15807648
申请日：2017-11-09
Applicant: FUJITSU LIMITED
Inventor： Tetsuro Yamada , AKIKO MATSUI , Mitsuhiko Sugane , Takahide Mukoyama , YOSHIYUKI HIROSHIMA , Kohei Choraku
IPC: H05K1/02 , H05K1/18 , H05K1/11 , H01L23/498 , H01L23/00
CPC classification number: H05K1/0213 , H01L23/49816 , H01L24/16 , H01L2224/16235 , H01L2924/15311 , H05K1/0265 , H05K1/113 , H05K1/115 , H05K1/116 , H05K1/181 , H05K2201/09463 , H05K2201/09609 , H05K2201/0979 , H05K2201/10378 , H05K2201/10734
Abstract: A printed circuit board includes a power feeding layer to which a power supply voltage is applied, a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage to the electronic component, and a plurality of vias that electrically interconnects the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to an end of the area has a smaller via-diameter.
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2.发明申请WIRING BOARD, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF WIRING BOARD 审中-公开接线板，电子设备和接线板的制造方法公开(公告)号：US20170055343A1
公开(公告)日：2017-02-23
申请号：US15233216
申请日：2016-08-10
Applicant: FUJITSU LIMITED
Inventor： Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Yoshiyuki Hiroshima , Kohei Choraku
CPC classification number: H01P3/026 , H01P11/003 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/181 , H05K3/0058 , H05K2201/0723
Abstract: A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.
Abstract translation: 布线板包括：包括信号线的第一基板; 第二基板，其包括具有大于所述信号布线的面积的导体的导体，以及形成在所述导体的表面上并由具有与所述信号布线的图案对应的图案的绝缘体构成的突起，所述第二基板被布置 使得形成突起的导体的面朝向信号布线; 以及布置在信号线和导体之间并包括纤维构件的中间层。
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3.发明授权公开(公告)号：US09285560B2
公开(公告)日：2016-03-15
申请号：US14136218
申请日：2013-12-20
Applicant: FUJITSU LIMITED
Inventor： Kohei Choraku , Daisuke Usui , Masahiro Iwama , Takahiro Ooi , Tetsuro Yamada
CPC classification number: G02B6/46 , G02B6/4214 , G02B6/4221 , G02B6/43 , G02B21/36 , Y10T29/49769 , Y10T29/53022
Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.
Abstract translation: 一种光传输装置的制造方法，其特征在于，包括：在基板的一侧配置多个波导管，包括波导反射镜，透射侧光学模块和接收侧光学模块; 通过形成在基板中的开口从基板的另一侧，利用照相装置拍摄至少一个波导反射镜和对应于波导反射镜的发送侧光学模块或接收侧光学模块; 根据拍摄结果，检测发送侧光学模块的光轴中心或接收侧光学模块的光轴中心以及与所检测的光轴中心对应的波导反射镜的反射表面的中心位置 ; 并且基于检测结果对准和固定光波导与发射侧光学模块或接收侧光学模块之间的位置关系。
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公开(公告)号：US20140140033A1
公开(公告)日：2014-05-22
申请号：US14165201
申请日：2014-01-27
Applicant: FUJITSU LIMITED
Inventor： TAKAO SHINODA , Kohei Choraku
IPC: H05K5/06
CPC classification number: H05K5/061 , G06F1/1656 , H04M1/0262 , H04M1/18
Abstract: A portable electronic apparatus has a water-resistant structure in which a cover covers a surface of an opening formed in a casing of the portable electronic apparatus. The portable electronic apparatus includes a mounting unit that has an outer peripheral surface to which frame-shaped packing that encompasses the opening is attached, and is formed on any one among the casing and the cover; and a groove that is formed on an outer peripheral surface of the mounting unit, and holds the frame-shaped packing therein enabling a surface of the frame-shaped packing to be brought into pressure contact with any one among the casing and the cover to which the mounting is not formed. The mounting unit has a side and a corner, and is of a shape that encompasses the opening, and the groove has a shape at the corner different from that along the side.
Abstract translation: 便携式电子设备具有防水结构，其中盖覆盖形成在便携式电子设备的壳体中的开口的表面。 便携式电子设备包括安装单元，该安装单元具有安装有壳体和盖子中的任一个的外围表面，框架形密封件包围开口; 以及形成在安装单元的外周面上的槽，并且将框架状密封件保持在其中，能够使框架状密封件的表面与壳体和盖中的任一个压力接触， 不形成安装。 安装单元具有侧面和角部，并且具有包围开口的形状，并且凹槽具有与侧面不同的角部的形状。
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公开(公告)号：US11749874B2
公开(公告)日：2023-09-05
申请号：US17210561
申请日：2021-03-24
Applicant: FUJITSU LIMITED
Inventor： Kohei Choraku , Yoshiyuki Hiroshima
CPC classification number: H01P1/30 , G01R33/1223 , H01P1/20309 , H01P7/10
Abstract: A balanced-type circular disk resonator includes a circular conductive layer, a conductive member including a first conductive portion provided on a first surface of the circular conductive layer to enable a first dielectric board, a dielectric property of which is measured, to be placed between the first conductive portion and the circular conductive layer, and a second conductive portion provided on a second surface of the circular conductive layer to enable a second dielectric board, a dielectric property of which is measured, to be placed between the second conductive portion and the circular conductive layer, the second surface being opposite to the first surface with regard to the circular conductive layer, and a temperature adjustment unit coupled to the conductive member and configured to adjust temperatures of the first conductive portion and the second conductive portion.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180156993A1
公开(公告)日：2018-06-07
申请号：US15813191
申请日：2017-11-15
Applicant: FUJITSU LIMITED
Inventor： YOSHIYUKI HIROSHIMA , AKIKO MATSUI , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Kohei Choraku
CPC classification number: G02B6/4245 , G02B6/12002 , G02B6/4214 , G02B6/4221 , G02B6/4238 , G02B6/4239 , G02B6/4246
Abstract: A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical axis of the light emitting element coincides with a center line of the optical waveguide, and a bonding portion of the light emitting element is bonded to the conductive portion.
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公开(公告)号：US20170290144A1
公开(公告)日：2017-10-05
申请号：US15465895
申请日：2017-03-22
Applicant: FUJITSU LIMITED
Inventor： YOSHIYUKI HIROSHIMA , AKIKO MATSUI , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Kohei Choraku
CPC classification number: H05K1/0271 , H05K3/0052 , H05K3/043 , H05K3/4644 , H05K2201/09263 , H05K2201/09381 , H05K2201/09418
Abstract: A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.
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公开(公告)号：US09572293B2
公开(公告)日：2017-02-14
申请号：US14167246
申请日：2014-01-29
Applicant: FUJITSU LIMITED
Inventor： Yoshiyuki Hiroshima , Naoki Nakamura , Akiko Matsui , Tetsuro Yamada , Takahiro Ooi , Kohei Choraku
CPC classification number: H05K13/0408 , H05K3/3436 , H05K13/0409 , H05K13/046 , H05K2201/10121 , H05K2203/166 , Y10T29/49131
Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.
Abstract translation: 一种用于光学部件的放置装置，包括：吸嘴，其包括具有吸入面的吸嘴主体，吸入口，被吸入吸入口的光学部件，设置在吸入面上的多个喷嘴电极， 喷嘴电极与设置在光学部件上的多个部件电极中的对应的一个电极接触，以便在多个喷嘴电极中的每一个与多个部件电极中的相应一个之间建立电导通。
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公开(公告)号：US09398709B2
公开(公告)日：2016-07-19
申请号：US14165201
申请日：2014-01-27
Applicant: FUJITSU LIMITED
Inventor： Takao Shinoda , Kohei Choraku
CPC classification number: H05K5/061 , G06F1/1656 , H04M1/0262 , H04M1/18
Abstract: A portable electronic apparatus has a water-resistant structure in which a cover covers a surface of an opening formed in a casing of the portable electronic apparatus. The portable electronic apparatus includes a mounting unit that has an outer peripheral surface to which frame-shaped packing that encompasses the opening is attached, and is formed on any one among the casing and the cover; and a groove that is formed on an outer peripheral surface of the mounting unit, and holds the frame-shaped packing therein enabling a surface of the frame-shaped packing to be brought into pressure contact with any one among the casing and the cover to which the mounting is not formed. The mounting unit has a side and a corner, and is of a shape that encompasses the opening, and the groove has a shape at the corner different from that along the side.
Abstract translation: 便携式电子设备具有防水结构，其中盖覆盖形成在便携式电子设备的壳体中的开口的表面。 便携式电子设备包括安装单元，该安装单元具有安装有壳体和盖子中的任一个的外围表面，框架形密封件包围开口; 以及形成在安装单元的外周面上的槽，并且将框架状密封件保持在其中，能够使框架状密封件的表面与壳体和盖中的任一个压力接触， 不形成安装。 安装单元具有侧面和角部，并且具有包围开口的形状，并且凹槽具有与侧面不同的角部的形状。
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公开(公告)号：US11435385B2
公开(公告)日：2022-09-06
申请号：US16850054
申请日：2020-04-16
Applicant: FUJITSU LIMITED
Inventor： Kazuki Takahashi , Akiko Matsui , Kohei Choraku , Mitsunori Abe , Tetsuro Yamada , Yoshio Kobayashi , Sotaro Kobayashi
IPC: G01R27/26
Abstract: A specific conductivity measurement method includes: performing first measurement to obtain a resonance frequency f1 that is outputted to a measuring device when the first and second dielectric flat plates each have a thickness t1, and an unloaded Qu1 that corresponds to the resonance frequency f1; performing second measurement to obtain a resonance frequency f2 that is outputted to the measuring device when the first and second dielectric flat plates each have a thickness t2 that is different from the thickness t1, and an unloaded Qu2 that corresponds to the resonance frequency f2; and calculating a specific conductivity σr of the copper foil and the first and second conductor flat plates based on an arithmetic equation that includes the resonance frequency the unloaded Qu1, the resonance frequency f2, and the unloaded Qu2.
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