Invention Application
- Patent Title: METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT
- Patent Title (中): 制造陶瓷电子元件的方法
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Application No.: US15253979Application Date: 2016-09-01
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Publication No.: US20170069428A1Publication Date: 2017-03-09
- Inventor: Kotaro SHIMIZU
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2015-173824 20150903
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/248 ; H01G4/12
Abstract:
A method of manufacturing a ceramic electronic component includes adding a modifier to a surface of chip containing ceramics and an organic material, applying a conductive paste on the surface of the chip to which the modifier has been added, and firing the chip along with the conductive paste applied on the chip.
Information query
