ELECTRONIC COMPONENT MANUFACTURING METHOD AND FILM FORMING APPARATUS
    2.
    发明申请
    ELECTRONIC COMPONENT MANUFACTURING METHOD AND FILM FORMING APPARATUS 审中-公开
    电子元件制造方法和薄膜成型装置

    公开(公告)号:US20160059263A1

    公开(公告)日:2016-03-03

    申请号:US14825013

    申请日:2015-08-12

    Abstract: An electronic component manufacturing method includes inserting an electronic component base body, which has a substantially rectangular parallelepiped shape and paired opposing end surfaces, paired opposing lateral surfaces connecting the end surfaces, and paired opposing principal surfaces perpendicular to the end surfaces and the lateral surfaces and connecting the end surfaces, in a receiving portion of a component holder. The receiving portion defining an accommodation space that is capable of receiving the electronic component base body, forming an oleophobic film over the surfaces of the electronic component base body by exposing the surfaces of the electronic component base body inserted in the receiving portion to gas containing an oleophobic material, taking out the electronic component base body, which includes the oleophobic film formed thereon, from the receiving portion, and forming outer electrodes on the electronic component base body having been taken out.

    Abstract translation: 一种电子部件制造方法,包括:插入电子部件基体,该电子部件基体具有大致长方体形状和成对的相对的端面,连接端面的成对的相对侧面和与端面和侧面垂直的成对的相对的主面, 在部件保持器的接收部分中连接端面。 所述接收部分限定容纳空间,所述容纳空间能够接收所述电子部件基体,通过将插入在所述接收部中的所述电子部件基体的表面暴露于含有所述电子部件基体的气体,在所述电子部件基体的表面上形成疏油膜 疏油材料,从接收部分取出包括形成在其上的疏油膜的电子部件基体,并且在已经取出的电子部件基体上形成外部电极。

    MULTILAYER CERAMIC CAPACITOR
    3.
    发明申请

    公开(公告)号:US20200273623A1

    公开(公告)日:2020-08-27

    申请号:US16788345

    申请日:2020-02-12

    Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 μm or more and about 1.5 μm or less, and having a maximum diameter of about 5.0 μm or less.

    ALIGNING DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE ALIGNING DEVICE
    4.
    发明申请
    ALIGNING DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE ALIGNING DEVICE 有权
    用于使用校准装置生产电子元件的校准装置和方法

    公开(公告)号:US20170004924A1

    公开(公告)日:2017-01-05

    申请号:US15267555

    申请日:2016-09-16

    Abstract: In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig.

    Abstract translation: 在对准装置中,在平面图中,第一传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域以预定间隔位于第一传送夹具的第一凹部内。 第二传送夹具的第一凹部允许第二传送夹具的第二凹部的整个区域以预定间隔位于第二传送夹具的第一凹部内。 当第一传送夹具和第二传送夹具彼此重叠时,第二传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域位于第二传送夹具的第一凹部内预定的 间隔。 通过使第一传送夹具和第二传送夹具彼此重叠,将对准物体转印到第一传送夹具的空腔中,将对准物体从第一传送夹具的空腔传递到第二传送夹具的空腔 转移夹具

    ELECTRONIC COMPONENT
    5.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号:US20150116899A1

    公开(公告)日:2015-04-30

    申请号:US14517957

    申请日:2014-10-20

    CPC classification number: H01G4/232 H01C7/008 H01G4/30

    Abstract: An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μm2 or larger.

    Abstract translation: 电子部件具有约0.6mm至约1.0mm×约0.3mm至约0.5mm×约0.07mm至约0.15mm的尺寸(长×宽×厚)。 由第一假想直线限定的三角形区域与位于宽度方向中心并沿长度方向延伸的第一主表面的外部电极的一部分的顶部接触,第二假想直线 与位于宽度方向中心的第一端面的外部电极的一部分的顶部接触,并且在厚度方向上延伸,并且第三假想直线与中心的外部电极接触 宽度方向相对于第一和第二假想直线倾斜约45°,为约450μm2以上。

    METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT 审中-公开
    制造陶瓷电子元件的方法

    公开(公告)号:US20170069428A1

    公开(公告)日:2017-03-09

    申请号:US15253979

    申请日:2016-09-01

    Inventor: Kotaro SHIMIZU

    CPC classification number: H01G4/30 H01G4/232 H01G4/2325

    Abstract: A method of manufacturing a ceramic electronic component includes adding a modifier to a surface of chip containing ceramics and an organic material, applying a conductive paste on the surface of the chip to which the modifier has been added, and firing the chip along with the conductive paste applied on the chip.

    Abstract translation: 一种陶瓷电子部件的制造方法,其特征在于,在含有陶瓷和有机材料的表面上添加改性剂,在已添加有改性剂的芯片的表面上涂敷导电性浆料,并将该导体 贴在芯片上。

    ALIGNING DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE ALGINING DEVICE
    7.
    发明申请
    ALIGNING DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE ALGINING DEVICE 有权
    对准装置和使用该绘图装置生产电子元件的方法

    公开(公告)号:US20150082591A1

    公开(公告)日:2015-03-26

    申请号:US14488448

    申请日:2014-09-17

    Abstract: In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig.

    Abstract translation: 在对准装置中,在平面图中,第一传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域以预定间隔位于第一传送夹具的第一凹部内。 第二传送夹具的第一凹部允许第二传送夹具的第二凹部的整个区域以预定间隔位于第二传送夹具的第一凹部内。 当第一传送夹具和第二传送夹具彼此重叠时,第二传送夹具的第一凹部允许第一传送夹具的第二凹部的整个区域位于第二传送夹具的第一凹部内预定的 间隔。 通过使第一传送夹具和第二传送夹具彼此重叠,将对准物体转印到第一传送夹具的空腔中,将对准物体从第一传送夹具的空腔传递到第二传送夹具的空腔 转移夹具

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