Invention Application
US20170069526A1 CHUCK ASSEMBLY WITH TILTABLE CHUCK AND SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME
审中-公开
具有可折叠式卡盘和包括其中的半导体制造系统的卡盘组件
- Patent Title: CHUCK ASSEMBLY WITH TILTABLE CHUCK AND SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME
- Patent Title (中): 具有可折叠式卡盘和包括其中的半导体制造系统的卡盘组件
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Application No.: US15170151Application Date: 2016-06-01
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Publication No.: US20170069526A1Publication Date: 2017-03-09
- Inventor: Jongsoon PARK , Jong-Kyu KIM , Jung-Ik OH , Sang-Kuk KIM , Jongchul PARK
- Applicant: Jongsoon PARK , Jong-Kyu KIM , Jung-Ik OH , Sang-Kuk KIM , Jongchul PARK
- Priority: KR10-2015-0124939 20150903
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01J37/305 ; H01L21/263
Abstract:
A chuck assembly includes a chuck to hold a substrate, and a pillar coupled to the chuck to support the chuck, an axis of the pillar passing through a center of the pillar in a longitudinal direction of the pillar, wherein the chuck has a top surface, which is inclined with respect to the axis of the pillar, the top surface of the chuck being precessionally rotatable about the axis of the pillar.
Information query
IPC分类:
