Invention Application
- Patent Title: Monitor Structures and Methods of Formation Thereof
- Patent Title (中): 监测结构及其形成方法
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Application No.: US15352392Application Date: 2016-11-15
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Publication No.: US20170069554A1Publication Date: 2017-03-09
- Inventor: Albert Birner , Tobias Herzig
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/48 ; H01L21/768
Abstract:
A method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.
Public/Granted literature
- US10014230B2 Monitor structures and methods of formation thereof Public/Granted day:2018-07-03
Information query
IPC分类:
