Invention Application
US20170070685A1 STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA
有权
堆叠式模块化结构高分辨率热芯片摄像机
- Patent Title: STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA
- Patent Title (中): 堆叠式模块化结构高分辨率热芯片摄像机
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Application No.: US14845861Application Date: 2015-09-04
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Publication No.: US20170070685A1Publication Date: 2017-03-09
- Inventor: Louise C. Sengupta , Pierre-Alain S. Auroux , Evan A. Binkerd , Richard J. Blackwell, JR. , Mihir D. Boal , Jeffrey F. Bryant , Don A. Harris , Donald D. McManus
- Applicant: BAE Systems Information and Electronic Systems Integration Inc.
- Main IPC: H04N5/33
- IPC: H04N5/33 ; H01L27/115 ; H01L21/78 ; H01L27/108 ; H04N5/225 ; H01L27/146
Abstract:
An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.
Public/Granted literature
- US09787914B2 Stacked modular architecture high-resolution thermal chip camera Public/Granted day:2017-10-10
Information query
