公开(公告)号：US20170070685A1

公开(公告)日：2017-03-09

申请号：US14845861

申请日：2015-09-04

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Louise C. Sengupta ,  Pierre-Alain S. Auroux ,  Evan A. Binkerd ,  Richard J. Blackwell, JR. ,  Mihir D. Boal ,  Jeffrey F. Bryant ,  Don A. Harris ,  Donald D. McManus

IPC: H04N5/33 ,  H01L27/115 ,  H01L21/78 ,  H01L27/108 ,  H04N5/225 ,  H01L27/146

CPC classification number: H04N5/33 ,  H01L27/10805 ,  H01L27/11517 ,  H01L27/11563 ,  H01L27/11582 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L28/00 ,  H04N5/2257

Abstract: An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.

Abstract translation: 包括电子板，具有应用专用集成电路（ASIC）的照相机电路卡组件（CCA），同步动态随机存取存储器（SDRAM），闪存）的非冷却的高分辨率12微米像素间距3D堆叠组件热像仪 存储器，间隔器，晶片级封装的焦平面阵列（FPA）晶片，其上具有在FPA上的透镜壳体附接环和窗口。