Invention Application
- Patent Title: DIFFUSION BONDED LEAD CONNECTOR
- Patent Title (中): 扩散连接引线连接器
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Application No.: US15363178Application Date: 2016-11-29
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Publication No.: US20170072189A1Publication Date: 2017-03-16
- Inventor: Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
- Applicant: Medtronic, Inc.
- Main IPC: A61N1/05
- IPC: A61N1/05 ; H01R13/187 ; H01R43/02 ; C23C14/18 ; B23K20/02 ; C23C14/34 ; C23C14/10 ; H01R24/58 ; B23K26/21
Abstract:
A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
Public/Granted literature
- US11213673B2 Diffusion bonded lead connector Public/Granted day:2022-01-04
Information query
