发明申请
US20170073277A1 APPLYING SILICON METAL-CONTAINING BOND LAYER TO CERAMIC OR CERAMIC MATRIX COMPOSITE SUBSTRATES 审中-公开
将含金属的金属层应用于陶瓷或陶瓷基复合基板

APPLYING SILICON METAL-CONTAINING BOND LAYER TO CERAMIC OR CERAMIC MATRIX COMPOSITE SUBSTRATES
摘要:
In some examples, a method may include depositing, from a slurry comprising particles including silicon metal, a bond coat precursor layer including the particles comprising silicon metal directly on a ceramic matrix composite substrate. The method also may include locally heating the bond coat precursor layer to form a bond coat comprising silicon metal. Additionally, the method may include forming a protective coating on the bond coat. In some examples, an article may include a ceramic matrix composite substrate, a bond coat directly on the substrate, and a protective coating on the bond coat. The bond coat may include silicon metal and a metal comprising at least one of Zr, Y, Yb, Hf, Ti, Al, Cr, Mo, Nb, Ta, or a rare earth metal.
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