Invention Application
- Patent Title: COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Patent Title (中): 在数据中心冷却电子设备
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Application No.: US15359154Application Date: 2016-11-22
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Publication No.: US20170079167A1Publication Date: 2017-03-16
- Inventor: Emad Samadiani , Eehern J. Wong , Gregory P. Imwalle , Soheil Farshchian
- Applicant: Google Inc.
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
Public/Granted literature
- US09961803B2 Cooling electronic devices in a data center Public/Granted day:2018-05-01
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