Abstract:
A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
Abstract:
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
Abstract:
A cooling apparatus for rack-mounted computing devices includes a heat sink including a thermal interface to conductively contact a computing device mounted on a printed circuit board; a cold plate including a first portion in thermal communication with the heat sink with a working fluid, and a second portion that includes a cooling coil in thermal communication with the first portion, the cooling coil including an inlet to receive chilled liquid; a fan positioned to circulate airflow over the cold plate; and a controller coupled to the fan to adjust a speed of the fan in response to an output of a sensor coupled to the computing device.
Abstract:
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
Abstract:
A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
Abstract:
A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.
Abstract:
Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.
Abstract:
An aligning apparatus for mounting cards into a housing space is provided. The aligning apparatus includes a first line card having a mating portion and a card guide assembly coupled to the first line card. The mating portion is configured to mate with a backplane of the housing space. The card guide assembly varies from a first height at a first portion to a second height at a second portion. The varying heights correspond to an arrangement of components on a neighboring card. The first and second portions are configured to guide directional movement of the first line card in relation to one or more components on the neighboring card during insertion of the first line card into the housing space. In this regard, the first line card is guided past the one or more components on the neighboring card as the mating portion of the first line card is moved toward the backplane.
Abstract:
Methods, systems, and apparatus for cooling control in a datacenter. In one aspect, a method includes, for each processing device in a cluster of processing devices configured to perform a distributed task, wherein each processing device is thermally controlled by a cooling system that controls cooling to each processing device on an individual basis, determining whether the processing device is operating within a performance target for the cluster of processing devices; for each processing device determined to not be operating within the performance target for the cluster, generating a respective control signal to adjust the cooling delivery to the processing device to cause the performance of the processing device to be within the performance target for the cluster of processing devices; and for each processing device determined to be operating within the performance target for the cluster, maintaining the cooling delivery to the processing device.
Abstract:
Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.