发明申请
- 专利标题: HEAT TRANSFER SYSTEM
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申请号: US15311684申请日: 2015-04-10
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公开(公告)号: US20170082384A1公开(公告)日: 2017-03-23
- 发明人: Takuya FUSE , Takashi KANEKO , Touru KAWAGUCHI
- 申请人: DENSO CORPORATION
- 优先权: JP2014-106783 20140523
- 国际申请: PCT/JP2015/002034 WO 20150410
- 主分类号: F28F23/02
- IPC分类号: F28F23/02 ; F28D15/00 ; C09K5/20
摘要:
A heat transfer system has a heat source that generates heat, a heat dissipator that dissipates heat, and a flow controller (hat controls a flow of a heat medium in a heat medium passage (n which the heat medium in a liquid state flows. The heat from the heat source is transferred to the heat dissipator through the heat medium. The heat medium is a solution that includes a solvent and at least one solute. The at least one solute is configured by a molecule. The molecule has (i) a first portion that selectively approaches a solid-liquid interface of the solvent when a temperature of the heat medium becomes lower than or equal to a predetermined base temperature and (ii) a second portion that is lyophobic and coupled with the first portion.
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