公开(公告)号：US20210016634A1

公开(公告)日：2021-01-21

申请号：US17064831

申请日：2020-10-07

Applicant: DENSO CORPORATION

Inventor： Jun YAMAOKA ,  Masaharu SAKAI ,  Yuuji OKAMURA ,  Shogo HAYAKAWA ,  Yasuki OMORI ,  Satoshi TAKOTANI ,  Takashi KANEKO ,  Marie NAGAHAMA ,  Yasuhiko NIIMI ,  Yusuke KOMATSUBARA ,  Takahito NAKAMURA

IPC: B60H1/34 ,  F24F13/072

Abstract: An air discharge device includes a duct that defines a flow passage through which a working air flow to be discharged passes, and a hole forming member defining an air discharge hole as an outlet of the working air flow. The hole forming member has a vortex generation structure configured to generate an auxiliary vortex having a vortex characteristic including a vortex rotation direction and a vortex axis direction. The vortex characteristic of the auxiliary vortex is different from that of a lateral vortex generated by the working air flow at a downstream side of the air discharge hole. The vortex generation structure is configured in the hole forming member so that the auxiliary vortex collides with the lateral vortex in a state where at least one of the vortex rotation direction and the vortex axial direction of the vortex characteristic is different from that of the lateral vortex.

公开(公告)号：US20170082384A1

公开(公告)日：2017-03-23

申请号：US15311684

申请日：2015-04-10

Applicant: DENSO CORPORATION

Inventor： Takuya FUSE ,  Takashi KANEKO ,  Touru KAWAGUCHI

IPC: F28F23/02 ,  F28D15/00 ,  C09K5/20

CPC classification number: F28F23/02 ,  B01J19/0013 ,  B01J2219/00054 ,  C09K5/20 ,  F28D15/00 ,  F28D2021/0094 ,  F28F2265/14

Abstract: A heat transfer system has a heat source that generates heat, a heat dissipator that dissipates heat, and a flow controller (hat controls a flow of a heat medium in a heat medium passage (n which the heat medium in a liquid state flows. The heat from the heat source is transferred to the heat dissipator through the heat medium. The heat medium is a solution that includes a solvent and at least one solute. The at least one solute is configured by a molecule. The molecule has (i) a first portion that selectively approaches a solid-liquid interface of the solvent when a temperature of the heat medium becomes lower than or equal to a predetermined base temperature and (ii) a second portion that is lyophobic and coupled with the first portion.

公开(公告)号：US20250034735A1

公开(公告)日：2025-01-30

申请号：US18914958

申请日：2024-10-14

Applicant: DENSO CORPORATION

Inventor： Toshihisa NAKAJIMA ,  Kota SHIBATA ,  Yasutoshi DOI ,  Shota CHATANI ,  Daichi SAKURAI ,  Shinji KAWADA ,  Hideaki OKAWA ,  Seiichiro WASHINO ,  Takashi KANEKO

IPC: C25B15/02 ,  B01D53/02 ,  B01D53/26

Abstract: A hydrogen production system includes a hydrogen generation device to generate hydrogen, and a compressor to compress the hydrogen. The hydrogen generation device and the compressor are connected by a first line. The compressor and a hydrogen utilization equipment to utilize the hydrogen compressed by the compressor are connected by a second line. A hydrogen storage unit to store the hydrogen compressed by the compressor is connected to the first line by a first bypass line. The first bypass line has a first control valve to control a flow of the hydrogen in the first bypass line.

公开(公告)号：US20200017746A1

公开(公告)日：2020-01-16

申请号：US16558372

申请日：2019-09-03

Applicant: DENSO CORPORATION

Inventor： Junichi NARUSE ,  Touru KAWAGUCHI ,  Kouji INAGAKI ,  Takashi KANEKO

IPC: C09K5/20 ,  F28F23/00

Abstract: A base fluid for heat medium contains a hydrophilic ionic liquid and water. A molecular weight of the hydrophilic ionic liquid is at or below 150. The hydrophilic ionic liquid is methylammonium nitrate. Since the ionic liquid has favorable thermal stability, the thermal stability of the base fluid for heat medium can be secured. Since the molecular weight of the hydrophilic ionic liquid is at or below 150, the base fluid for heat medium has a low kinematic viscosity. Further, since the freezing point depression effect can be obtained by dissolving the ionic liquid in water, a low freezing point can be realized.

公开(公告)号：US20190331437A1

公开(公告)日：2019-10-31

申请号：US16438630

申请日：2019-06-12

Applicant: DENSO CORPORATION

Inventor： Masanori JINNOH ,  Aun OTA ,  Hisayoshi OSHIMA ,  Hidehiko HIRAMATSU ,  Takashi KANEKO

IPC: F28F13/00

Abstract: A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.