Invention Application
- Patent Title: Methods to Reduce Case Height for Capacitors
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Application No.: US15263812Application Date: 2016-09-13
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Publication No.: US20170084397A1Publication Date: 2017-03-23
- Inventor: Keith Lee Moore , Philip M. Lessner , Chris Stolarski , James Allen Fife , Liancai Ning
- Applicant: KEMET Electronics Corporation
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/052 ; H01G9/07 ; H01G9/012

Abstract:
A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. A second substrate is then placed over the forming substrate with the anode precursors between the forming substrate and the second substrate thereby forming a sandwiched assembly. The sandwiched assembly is heated to a sintering temperature of the anode precursors thereby forming the sintered powder anodes. The and sintered powder anodes are removed from between the forming substrate and the second substrate.
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