公开(公告)号：US20170084397A1

公开(公告)日：2017-03-23

申请号：US15263812

申请日：2016-09-13

Applicant: KEMET Electronics Corporation

Inventor： Keith Lee Moore ,  Philip M. Lessner ,  Chris Stolarski ,  James Allen Fife ,  Liancai Ning

IPC: H01G9/00 ,  H01G9/052 ,  H01G9/07 ,  H01G9/012

CPC classification number: H01G9/0029 ,  H01G9/0032 ,  H01G9/012 ,  H01G9/052 ,  H01G9/07

Abstract: A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. A second substrate is then placed over the forming substrate with the anode precursors between the forming substrate and the second substrate thereby forming a sandwiched assembly. The sandwiched assembly is heated to a sintering temperature of the anode precursors thereby forming the sintered powder anodes. The and sintered powder anodes are removed from between the forming substrate and the second substrate.