Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Application No.: US15267183Application Date: 2016-09-16
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Publication No.: US20170092504A1Publication Date: 2017-03-30
- Inventor: Akihiro KUBO , Teruhiko KODAMA
- Applicant: TOKYO ELECTRON LIMITED
- Priority: JP2015-190053 20150928
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B24B37/20 ; H01L21/308 ; H01L21/67 ; H01L21/02
Abstract:
There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.
Public/Granted literature
- US10074542B2 Substrate processing method and substrate processing apparatus Public/Granted day:2018-09-11
Information query
IPC分类:
