Invention Application
- Patent Title: MONITORING THICKNESS UNIFORMITY
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Application No.: US15279862Application Date: 2016-09-29
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Publication No.: US20170097231A1Publication Date: 2017-04-06
- Inventor: Andrzej Peczalski , Fouad Nusseibeh
- Applicant: Honeywell International Inc.
- Main IPC: G01B15/02
- IPC: G01B15/02 ; G01S13/88

Abstract:
Devices, methods, and systems for monitoring thickness uniformity are described herein. One system includes a transmitter configured to transmit a signal through a portion of a material while the material is moving, an attenuator configured to absorb a first portion of the transmitted signal, a reflector configured to reflect a second portion of the transmitted signal, a receiver configured to receive the reflected signal, and a computing device configured to determine a thickness of the portion of the material based on a time delay between the transmission of the signal and the reception of the reflected signal
Public/Granted literature
- US10520302B2 Monitoring thickness uniformity Public/Granted day:2019-12-31
Information query