Invention Application
- Patent Title: DEPOSITION OF SMOOTH METAL NITRIDE FILMS
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Application No.: US15231611Application Date: 2016-08-08
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Publication No.: US20170098546A1Publication Date: 2017-04-06
- Inventor: Tom E. Blomberg , Jaakko Anttila
- Applicant: ASM IP Holding B.V.
- Main IPC: H01L21/285
- IPC: H01L21/285 ; C23C16/34 ; C23C16/455

Abstract:
In one aspect, methods of forming smooth ternary metal nitride films, such as TixWyNz films, are provided. In some embodiments, the films are formed by an ALD process comprising multiple super-cycles, each super-cycle comprising two deposition sub-cycles. In one sub-cycle a metal nitride, such as TiN is deposited, for example from TiCl4 and NH3, and in the other sub-cycle an elemental metal, such as W, is deposited, for example from WF6 and Si2H6. The ratio of the numbers of each sub-cycle carried out within each super-cycle can be selected to achieve a film of the desired composition and having desired properties.
Public/Granted literature
- US09704716B2 Deposition of smooth metal nitride films Public/Granted day:2017-07-11
Information query
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