Invention Application
- Patent Title: SUBSTRATE CARRIER, A PROCESSING ARRANGEMENT AND A METHOD
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Application No.: US14872184Application Date: 2015-10-01
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Publication No.: US20170098570A1Publication Date: 2017-04-06
- Inventor: Francisco Javier Santos Rodriguez , Roland Rupp , Ronny Kern , Josef Unterweger
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/683
- IPC: H01L21/683

Abstract:
According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.
Public/Granted literature
- US10699934B2 Substrate carrier, a processing arrangement and a method Public/Granted day:2020-06-30
Information query
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