Invention Application
- Patent Title: APPARATUS AND METHOD OF THREE DIMENSIONAL CONDUCTIVE LINES
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Application No.: US15379537Application Date: 2016-12-15
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Publication No.: US20170098596A1Publication Date: 2017-04-06
- Inventor: Chih-Yu Lin , Kao-Cheng Lin , Li-Wen Wang , Yen-Huei Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L27/10 ; G11C5/06 ; H01L25/065

Abstract:
An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
Public/Granted literature
- US09997436B2 Apparatus and method of three dimensional conductive lines Public/Granted day:2018-06-12
Information query
IPC分类: