- 专利标题: Configurable Routing for Packaging Applications
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申请号: US15378622申请日: 2016-12-14
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公开(公告)号: US20170098607A1公开(公告)日: 2017-04-06
- 发明人: Chung-Yu Lu , Hsien-Pin Hu , Shin-Puu Jeng , Shang-Yun Hou , Tzuan-Horng Liu , Shih-Wen Huang , Chun Hua Chang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号: H01L23/525
- IPC分类号: H01L23/525 ; H01L25/00 ; H01L23/498 ; H01L25/065 ; H01L23/00 ; H01L21/48
摘要:
Various structures having a fuse and methods for forming those structures are described. An embodiment is a method. The method comprises attaching a first die to a first side of a component using first electrical connectors. After the attaching, at least one of (i) the first die comprises a first fuse, (ii) the first side of the component comprises a second fuse, (iii) a second side of the component comprises a third fuse, the second side being opposite the first side, or (iv) a combination thereof. The method further comprises after the attaching the first die to the first side of the component, blowing the first fuse, the second fuse, the third fuse, or a combination thereof.
公开/授权文献
- US10262939B2 Configurable routing for packaging applications 公开/授权日:2019-04-16
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