Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE
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Application No.: US15181480Application Date: 2016-06-14
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Publication No.: US20170101307A1Publication Date: 2017-04-13
- Inventor: Chang Hyun LIM , Tae Hun LEE , Dae Hun JEONG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0141825 20151008
- Main IPC: B81B7/00
- IPC: B81B7/00 ; G01D11/24 ; H01L23/053 ; H01L25/16 ; H01L23/00
Abstract:
There is provided a semiconductor package that comprises a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer.
Information query
