BULK-ACOUSTIC WAVE RESONATOR
    1.
    发明申请

    公开(公告)号:US20210036683A1

    公开(公告)日:2021-02-04

    申请号:US16898835

    申请日:2020-06-11

    IPC分类号: H03H9/13 H03H9/02 H03H9/25

    摘要: A bulk-acoustic wave resonator includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer at least partially covering the lower electrode; and an upper electrode at least partially covering the piezoelectric layer. On a surface of the bulk-acoustic wave resonator, a centroid of an active area in which the lower electrode, the piezoelectric layer, and the upper electrode all overlap each other is aligned with a center of a rectangle defining an aspect ratio of the active area. The active area has a shape of a polygon symmetrical with respect to at least one axis passing through the center of the rectangle defining the aspect ratio. The aspect ratio is greater than or equal to 2 and less than or equal to 10.

    PRESSURE SENSOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    PRESSURE SENSOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    压力传感器元件及其制造方法

    公开(公告)号:US20170003187A1

    公开(公告)日:2017-01-05

    申请号:US15045684

    申请日:2016-02-17

    IPC分类号: G01L9/00

    CPC分类号: G01L9/0054 G01L9/0047

    摘要: A pressure sensor element includes a die; a concave groove formed in one surface of the die; a partition wall formed in the concave groove to be spaced apart from side walls, the partition wall partitioning the concave groove into a trench and a cavity; and a membrane formed on the die and covering the concave groove.

    摘要翻译: 压力传感器元件包括模具; 形成在模具的一个表面中的凹槽; 形成在所述凹槽中与侧壁间隔开的分隔壁,所述分隔壁将所述凹槽分隔成沟槽和空腔; 以及形成在模具上并覆盖凹槽的膜。

    PRESSURE SENSOR
    3.
    发明申请
    PRESSURE SENSOR 有权
    压力传感器

    公开(公告)号:US20160273985A1

    公开(公告)日:2016-09-22

    申请号:US14933043

    申请日:2015-11-05

    IPC分类号: G01L9/00

    CPC分类号: G01L9/0054 G01L19/0618

    摘要: A pressure sensor includes a sensor, an elastic support portion, a membrane, and a pressure detector. The sensor is accommodated in a frame of a base substrate. The elastic support portion is elastically connecting the sensor to the frame. The membrane is disposed on a surface of the sensor. The pressure detector is disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.

    摘要翻译: 压力传感器包括传感器,弹性支撑部分,膜和压力检测器。 传感器容纳在基底的框架中。 弹性支撑部分将传感器弹性地连接到框架。 膜设置在传感器的表面上。 压力检测器设置在膜上并且被配置为基于膜的移动来检测压力变化。

    BULK ACOUSTIC WAVE RESONATOR
    4.
    发明申请

    公开(公告)号:US20220140811A1

    公开(公告)日:2022-05-05

    申请号:US17220119

    申请日:2021-04-01

    IPC分类号: H03H9/17 H03H9/02

    摘要: A bulk acoustic wave resonator is provided. The resonator includes a substrate; a resonant portion including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on the substrate; and a temperature compensation layer disposed at least one of above and below the piezoelectric layer, wherein a material of the temperature compensation layer has a coefficient of thermal expansion of which a sign is opposite to a sign of a coefficient of thermal expansion of a material of the piezoelectric layer, and wherein a relation of a thickness of the temperature compensation layer and a thickness of the piezoelectric layer satisfies the following equation: 0.25

    BULK ACOUSTIC WAVE RESONATOR
    5.
    发明申请

    公开(公告)号:US20220123714A1

    公开(公告)日:2022-04-21

    申请号:US17232828

    申请日:2021-04-16

    IPC分类号: H03H9/08 H03H9/17

    摘要: A bulk acoustic wave resonator includes: a substrate; a resonant portion including a sequentially stacked first electrode, piezoelectric layer, and second electrode; a cavity defined between the substrate and the resonant portion; and a heat dissipation portion disposed in the cavity and supporting the resonant portion. The second electrode includes a first region and a second region having a thickness greater than a thickness of the first region, and the second region is disposed above the heat dissipation portion.

    PRESSURE SENSOR PACKAGE
    7.
    发明申请
    PRESSURE SENSOR PACKAGE 审中-公开
    压力传感器包装

    公开(公告)号:US20160313201A1

    公开(公告)日:2016-10-27

    申请号:US14990317

    申请日:2016-01-07

    IPC分类号: G01L9/02

    CPC分类号: G01L19/147

    摘要: A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.

    摘要翻译: 压力传感器封装包括衬底,压力传感器和半导体电路。 半导体电路设置在基板的一个表面上,并且具有向基板的一个表面开放的接收空间。 压力传感器连接到基板并设置在接收空间中。

    BULK-ACOUSTIC WAVE RESONATOR
    8.
    发明申请

    公开(公告)号:US20210320644A1

    公开(公告)日:2021-10-14

    申请号:US17074978

    申请日:2020-10-20

    IPC分类号: H03H9/17 H03H9/13 H03H9/02

    摘要: A bulk-acoustic wave resonator includes: a first electrode; a piezoelectric layer at least partially disposed on an upper portion of the first electrode; and a second electrode disposed to cover at least a portion of the piezoelectric layer. The second electrode includes a frame disposed at an edge of an active region of the bulk-acoustic wave resonator, and the first electrode, the piezoelectric layer and the second electrode are disposed to overlap one another at the edge of the active region. The frame includes a wall disposed at the edge of the active region and a trench formed on an internal side of the wall. An internal boundary line of the trench has a concave-convex shape in a plane parallel to an upper surface of the frame.

    BULK-ACOUSTIC WAVE RESONATOR
    9.
    发明申请

    公开(公告)号:US20210313954A1

    公开(公告)日:2021-10-07

    申请号:US16936807

    申请日:2020-07-23

    IPC分类号: H03H9/13 H03H9/17 H03H9/02

    摘要: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.

    BULK-ACOUSTIC WAVE RESONATOR
    10.
    发明申请

    公开(公告)号:US20200186125A1

    公开(公告)日:2020-06-11

    申请号:US16411273

    申请日:2019-05-14

    IPC分类号: H03H9/54 H03H9/02 H03H9/205

    摘要: A bulk-acoustic wave resonator includes: a first substrate formed of a first material; an insulating layer or a piezoelectric layer disposed on a first side of the first substrate; and a second substrate formed of a second material and disposed on a second side of the first substrate, wherein the second material has thermal conductivity that is higher than a thermal conductivity of the first material.