Invention Application
- Patent Title: ELECTRONIC COMPONENT
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Application No.: US15286122Application Date: 2016-10-05
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Publication No.: US20170103852A1Publication Date: 2017-04-13
- Inventor: Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou KUSANO
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-199994 20151008
- Main IPC: H01G4/002
- IPC: H01G4/002 ; H01G4/242 ; H01G4/12 ; H01G4/30

Abstract:
A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.
Public/Granted literature
- US10102971B2 Multilayer capacitor with an overcurrent protection device Public/Granted day:2018-10-16
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