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公开(公告)号：US20230073043A1
公开(公告)日：2023-03-09
申请号：US17899797
申请日：2022-08-31
Applicant: TDK CORPORATION
Inventor： Hisashi KOBAYASHI , Norihisa ANDO , Toshihiro IGUCHI , Kenya TAMAKI
Abstract: An electronic component with a metal terminal includes an electronic component having an element body, and external electrodes respectively provided on end surfaces facing each other in an X direction in the element body; and plate-shaped metal terminals having joint portions joined to the external electrodes, and leg portions provided to protrude beyond the electronic component in a Z direction. The leg portion of the metal terminal has an extending part continuously extending in the Z direction from the joint portion, a first bent part bent from a tip of the extending part to the electronic component side at a first angle formed to be an acute angle with respect to the extending part, and a second bent part bent from a tip of the first bent part at a second angle larger than the first angle with respect to the extending part.
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公开(公告)号：US20210358690A1
公开(公告)日：2021-11-18
申请号：US17243961
申请日：2021-04-29
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Norihisa ANDO , Kenya TAMAKI , Kayou MATSUNAGA
Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.
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公开(公告)号：US20200294719A1
公开(公告)日：2020-09-17
申请号：US16816856
申请日：2020-03-12
Applicant: TDK Corporation
Inventor： Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA , Yoshiki SATOU , Katsumi KOBAYASHI
Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.
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公开(公告)号：US20190080841A1
公开(公告)日：2019-03-14
申请号：US16121719
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Kenichi INOUE , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G2/065 , H01G4/01 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/38 , H05K3/341 , H05K2201/10431
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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公开(公告)号：US20180286584A1
公开(公告)日：2018-10-04
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/1227 , H01G2/06 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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Patent Agency Ranking
公开(公告)号：US20180182553A1
公开(公告)日：2018-06-28
申请号：US15854523
申请日：2017-12-26
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA , Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA
CPC classification number: H01G4/248 , H01G4/1227 , H01G4/224 , H01G4/2325 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.
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公开(公告)号：US20170186539A1
公开(公告)日：2017-06-29
申请号：US15391312
申请日：2016-12-27
Applicant: TDK CORPORATION
Inventor： Sunao MASUDA , Katsumi KOBAYASHI , Masahiro MORI , Kayou MATSUNAGA , Norihisa ANDO
Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.
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公开(公告)号：US20170098506A1
公开(公告)日：2017-04-06
申请号：US15276172
申请日：2016-09-26
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Atsushi TAKEDA , Hideki KANEKO
Abstract: An electronic component includes an element body having a pair of end surfaces opposing each other and a side surface adjacent to the pair of end surfaces, and an external electrode disposed on at least the end surface. The external electrode includes a conductive resin layer located on at least the end surface. A first thickness of the conductive resin layer located on a central region of the end surface is greater than a second thickness of the conductive resin layer located on a peripheral region of the end surface.
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公开(公告)号：US20160351333A1
公开(公告)日：2016-12-01
申请号：US15142530
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou KUSANO
CPC classification number: H01G4/40 , H01C7/02 , H01C7/021 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
Abstract translation: 第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。 第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。 多层电容器和过电流保护器件以这样的方式设置，使得设置第一外部电极的电极部分的侧表面和第二元件体的侧表面彼此相对。 第一外部电极的电极部分和第四外部电极彼此连接，并且连接导体和第三外部电极彼此连接。
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公开(公告)号：US20240087812A1
公开(公告)日：2024-03-14
申请号：US18359319
申请日：2023-07-26
Applicant: TDK CORPORATION
Inventor： Toshihiro IGUCHI , Hisashi KOBAYASHI , Norihisa ANDO , Kenya TAMAKI
CPC classification number: H01G4/2325 , H01G4/30
Abstract: An electronic component includes a component body, a metal terminal, and a bonding material. The component body includes an element body and an external electrode. The metal terminal includes a first main surface and a second main surface, and a side surface. The bonding material electrically and physically connects the external electrode and the metal terminal. The metal terminal includes a first metal layer including the first main surface, a second metal layer including the second main surface, and a terminal body including the side surface. The terminal body is exposed at the side surface, and the first metal layer and the second metal layer are separated from each other on the side surface. Each of the first metal layer and the second metal layer includes a Ni plated layer. The terminal body includes Cu. The bonding material includes solder.
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