Invention Application
- Patent Title: SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM
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Application No.: US15312464Application Date: 2015-05-12
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Publication No.: US20170110231A1Publication Date: 2017-04-20
- Inventor: Akihito MATSUTOMI , Nao KAMAKURA , Takashi HABU
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2014-111612 20140529; JP2015-088690 20150423
- International Application: PCT/JP2015/063643 WO 20150512
- Main IPC: H01F10/18
- IPC: H01F10/18 ; H01F1/147
Abstract:
The soft magnetic resin composition contains soft magnetic particles, epoxy resin, phenol resin, and acrylic resin. The soft magnetic particle content relative to the soft magnetic resin composition is 60 vol % or more. The soft magnetic resin composition after curing has a linear expansion coefficient of 22.0 ppm/° C. or less.
Information query
