Invention Application
- Patent Title: ATOMIC LAYER DEPOSITION METHODS AND STRUCTURES THEREOF
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Application No.: US15192570Application Date: 2016-06-24
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Publication No.: US20170110324A1Publication Date: 2017-04-20
- Inventor: Cheng-Yen TSAI , Hsin-Yi LEE , Chung-Chiang WU , Da-Yuan LEE , Weng CHANG , Ming-Hsing TSAI
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L21/28
- IPC: H01L21/28 ; C23C16/455

Abstract:
A method and structure for providing a pre-deposition treatment (e.g., of a work-function layer) to accomplish work function tuning. In various embodiments, a gate dielectric layer is formed over a substrate, and a work-function metal layer is deposited over the gate dielectric layer. In some embodiments, a first in-situ process including a pre-treatment process of the work-function metal layer is performed. By way of example, the pre-treatment process removes an oxidized layer of the work-function metal layer to form a treated work-function metal layer. In some embodiments, after performing the first in-situ process, a second in-situ process including a deposition process of another metal layer over the treated work-function metal layer is performed.
Public/Granted literature
- US09978601B2 Methods for pre-deposition treatment of a work-function metal layer Public/Granted day:2018-05-22
Information query
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