Invention Application
- Patent Title: MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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Application No.: US15295016Application Date: 2016-10-17
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Publication No.: US20170110337A1Publication Date: 2017-04-20
- Inventor: Kengo AKIMOTO , Yukinori SHIMA
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2015-206186 20151020
- Main IPC: H01L21/385
- IPC: H01L21/385 ; H01L29/66 ; H01L29/786 ; H01L27/12

Abstract:
A semiconductor device including an oxide conductor with high conductivity and high transmittance is provided. A manufacturing method for a semiconductor device includes the steps of: forming an oxide semiconductor over a first insulator; forming a second insulator over the first insulator and the oxide semiconductor; forming a first conductor over the second insulator; forming an etching mask over the first conductor; forming a second conductor including a region overlapping with the oxide semiconductor by etching the first conductor with use of the etching mask as a mask; removing the etching mask; and performing heat treatment after forming a hydrogen-containing layer over the second insulator and the second conductor.
Public/Granted literature
- US09852926B2 Manufacturing method for semiconductor device Public/Granted day:2017-12-26
Information query
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